Application of electrophoretic photoresist for printed wiring board.
نویسندگان
چکیده
منابع مشابه
Optical interconnect on printed wiring board
Integration of high-speed parallel optical interconnects into printed wiring boards (PWB) is studied. The aim is a hybrid optical–electrical board including both electrical wiring and embedded polymer waveguides. Robust optical coupling between the waveguide and the emitter/detector should be achieved by the use of automated pick-and-place assembly. Different coupling schemes were analyzed by c...
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The purpose of the paper is to outline MULTI-PRIDE, a system for supporting multi-layered printed wiring board design. It consists of (i) circuit bipartition, (ii) placement and routing on each outside layer, (iii) modi cation of wiring and compaction, and (iv) routing on inside layers.
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As a developer of world-class products including server and network devices, Fujitsu recognizes the printed wiring board (PWB) as a core component among the various components of those products. One basic element supporting high-quality PWBs is through-hole interconnection reliability. Existing methods for evaluating interconnections typically involve temperature cycle tests that subject the PW...
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When lead-free solder alloys mix with lead-free component and board metallizations during reflow soldering, the solder interconnections become multicomponent alloy systems whose microstructures cannot be predicted on the basis of the SnPb metallurgy. To better understand the influences of these microstructures on the reliability of lead-free electronics assemblies, SnAgCu-bumped components were...
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ژورنال
عنوان ژورنال: Circuit Technology
سال: 1990
ISSN: 1884-118X,0914-8299
DOI: 10.5104/jiep1986.5.34